CS8361 데이터 시트보기 (PDF) - ON Semiconductor
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CS8361 Datasheet PDF : 8 Pages
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CS8361
PACKAGE DIMENSIONS
D
A
16
9
SO−16L
DWF SUFFIX
CASE 751G−03
ISSUE C
q
1
8
16X B
B
0.25 M T A S B S
14X e
SEATING
PLANE
T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_ 7_
PACKAGE THERMAL DATA
Parameter
SO−16L D2PAK, 7−Pin
RqJC
Typical
18
3.5
RqJA
Typical
75
10−50*
*Depending on thermal properties of substrate. RqJA = RqJC + RqCA.
Unit
°C/W
°C/W
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