CS8361 데이터 시트보기 (PDF) - ON Semiconductor

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CS8361

5.0 V Dual Micropower Low Dropout Regulator with ENABLE and RESET

ON Semiconductor 

CS8361

Heat Sinks

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

determine the value of RqJA:

RQJA + RQJC ) RQCS ) RQSA

(3)

where:

RqJC = the junction−to−case thermal resistance,

RqCS = the case−to−heatsink thermal resistance, and

RqSA = the heatsink−to−ambient thermal resistance.

RqJC appears in the package section of the data sheet. Like

RqJA, it too is a function of package type. RqCS and RqSA are

functions of the package type, heatsink and the interface

between them. These values appear in heat sink data sheets

of heat sink manufacturers.

ORDERING INFORMATION*

Device

CS8361YDPS7G

CS8361YDPSR7G

Package

D2PAK−7

(Pb−Free)

D2PAK−7

(Pb−Free)

Shipping†

50 Units/Rail

750 / Tape & Reel

CS8361YDWF16G

SO−16L

(Pb−Free)

46 Units/Rail

CS8361YDWFR16G

SO−16L

(Pb−Free)

1000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe-

cifications Brochure, BRD8011/D.

*Contact your local sales representative for other package options including PSOP−20, TO−220−7, DIP−16, and SO−20L.

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