STTH312(2015) 데이터 시트보기 (PDF) - STMicroelectronics

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STTH312
(Rev.:2015)

Ultrafast recovery - 1200 V diode

STMicroelectronics 

Package information

2

Package information

STTH312

• Epoxy meets UL94, V0

• Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

2.1

DPAK package information

t(s) Figure 13. DPAK package outline

te Produc E

leA

o b4

sc2

- Ob L2

E1

Thermal pad

duct(s) H

R

ro L4

lete P e

b

A1

e1

D

D1 D

R

c

Obso A2

L1

L

V2

Gauge

0.25 plane

Note:

This package drawing may slightly differ from the physical package. However, all the

specified dimensions are guaranteed.

6/9

DocID12153 Rev 2

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