FEATURES
◇ Low profile package
◇ Ideal for automated placement
◇ Controlled avalanche characteristics
◇ Glass passivated junction
◇ Low reverse current
◇ High surge current capability
◇ Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
◇ Solder dip 260 °C, 40 s
◇ Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC