STTH506 데이터 시트보기 (PDF) - STMicroelectronics
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STTH506 Datasheet PDF : 9 Pages
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STTH506
Package mechanical data
Table 7. TO-220FPAC Dimensions
Dimensions
Ref. Millimeters
Inches
A
H
B
L2
L3
L4
Dia
L6
L5
D
F1
F
G1
G
L7
E
Min. Max. Min. Max.
A
4.4 4.6 0.173 0.181
B
2.5 2.7 0.098 0.106
D
2.5 2.75 0.098 0.108
E
0.45 0.70 0.018 0.027
F
0.75
1 0.030 0.039
F1 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H
10 10.4 0.393 0.409
L2
16 Typ.
0.63 Typ.
L3 28.6 30.6 1.126 1.205
L4
9.8 10.6 0.386 0.417
L5
2.9
3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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