CS8271 데이터 시트보기 (PDF) - Cherry semiconductor
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CS8271 Datasheet PDF : 6 Pages
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Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
Lead Count
8L SOIC
8L PDIP
Metric
Max Min
5.00 4.80
10.16 9.02
D
English
Max Min
.197 .189
.400 .355
Thermal Data
RQJC
typ
RQJA
typ
8L
SOIC
45
165
8L
PDIP
52
100
Surface Mount Narrow Body (D); 150 mil wide
ûC/W
ûC/W
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
1.57 (.062)
1.37 (.054)
REF: JEDEC MS-012
Plastic DIP (N); 300 mil wide
1.27 (.050) BSC
1.75 (.069) MAX
0.25 (0.10)
0.10 (.004)
D
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Ordering Information
Part Number
CS8271YD8
CS8271YDR8
CS8271YN8
Description
8L SOIC
8L SOIC (tape & reel)
8L PDIP
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
Rev. 3/26/97
6
© 1999 Cherry Semiconductor Corporation
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