ADG508F 데이터 시트보기 (PDF) - Analog Devices
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ADG508F Datasheet PDF : 12 Pages
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ADG508F/ADG509F/ADG528F
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
VEN, VA Digital Input . . . . . . . – 0.3 V to VDD + 2 V or 20 mA,
Whichever Occurs First
VS, Analog Input Overvoltage with Power ON . . . . . VSS – 25 V
to VDD + 40 V
VS, Analog Input Overvoltage with Power OFF
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–40 V to +55 V
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package
θJA, Thermal Impedance
16-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
18-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
Plastic Package
θJA, Thermal Impedance
16-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117°C
18-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110°C
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC Package
θJA, Thermal Impedance
Narrow Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77°C/W
Wide Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PLCC Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 90°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
ADG508F/ADG509F PIN CONFIGURATIONS
DIP/SOIC
DIP/SOIC
A0 1
16 A1
EN 2
15 A2
VSS 3
14 GND
S1 4 ADG508F 13 VDD
TOP VIEW
S2 5 (Not to Scale) 12 S5
S3 6
11 S6
S4 7
10 S7
D8
9 S8
A0 1
16 A1
EN 2
15 GND
VSS 3
14 VDD
S1A 4 ADG509F 13 S1B
TOP VIEW
S2A 5 (Not to Scale) 12 S2B
S3A 6
11 S3B
S4A 7
10 S4B
DA 8
9 DB
ADG528F PIN CONFIGURATIONS
DIP
PLCC
WR 1
A0 2
18 RS
17 A1
EN 3
16 A2
VSS 4 ADG528F 15 GND
S1 5 TOP VIEW 14 VDD
(Not to Scale)
S2 6
13 S5
S3 7
S4 8
12 S6
11 S7
D9
10 S8
3 2 1 20 19
EN 4
VSS 5
S1 6
S2 7
S3 8
ADG528F
TOP VIEW
(Not to Scale)
9 10 11 12 13
NC = NO CONNECT
18 A2
17 GND
16 VDD
15 S5
14 S6
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. C
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