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W83627EF 데이터시트 - Winbond

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W83627EF

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Winbond
Winbond Winbond

W83627EHF/EHG/EF/EG is an evolving product from Winbond's most popular I/O family. They
feature a whole new interface, namely LPC (Low Pin Count) interface, which will be supported in the new generation chip-set. This interface as its name suggests is to provide an economical implementation of I/O's interface with lower pin count and still maintains equivalent performance as its ISA interface counterpart. Approximately 40 pin counts are saved in LPC I/O comparing to ISA implementation. It is fully transparent in terms of software which means no BIOS or device driver update is needed except chip-specific configuration.

 

W83627EF

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LPC I/O
Winbond
WINBOND LPC I/O
Winbond
Winbond LPC I/O
Winbond
WINBOND LPC I/O
Winbond
W83627DHG LPC I/O
Winbond
WINBOND LPC I/O
Winbond
Super Hardware Monitor + LPC I/O
Feature Integration Technology Inc.
64-Pin Super I/O with LPC Interface
SMSC -> Microchip
56-Pin Super I/O with LPC Interface
SMSC -> Microchip
LPC Super I/O with Hardware Monitoring Block
SMSC -> Microchip

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