제조사
Chip Integration Technology Corporation
■ Features
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.SK12ASG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AC / SMAS
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : Approximated 0.08 gram
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
Frontier Electronics.
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation
1A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
Frontier Electronics.
1A Surface Mount Schottky Barrier Rectifiers
Chip Integration Technology Corporation