Features
• Tiny plastic SMD package.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.B140WSG.
• Lead-free parts meet environmental standards of
   MIL-STD-19500 /228

Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-323
• Terminals : Solder plated, solderable per
                     MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : 0.0002 ounce, 0.005 gram