GENERAL DESCRIPTION
The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi
message voice record and playback device ideally suited to a variety of electronic systems. The
message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the
specific device.

FEATURES
Integrated message management systems for single-chip, push-button applications 
  o  REC:level-trigger for recording
  o  PLAY:edge-trigger for individual message or level-trigger for looping playback sequentially
  o  ERASE:edge-triggered erase for first or last message or level-triggered erase for all messages
  o  FWD:edge-trigger to advance to the next message or fast message scan during the playback
  o  VOL: 8 levels output volume control
  o  INT RDY : ready or busy status indication
  o  RESET: return to the default state
  o Automatic power-down after each operation cycle 
Message and operation indicators
  o Four customizable Sound Effects (SEs) for audible indication
  o Optional vAlert (voiceAlert) to indicate the presence of new messages
  o LED: stay on during recording, blink during playback, forward and erase operations 
Dual operating modes
  o  Standalone mode:
     ƒIntegrated message management techniques
     Automatic power-down after each operation cycle
  o  SPI mode:
    Fully user selectable and controllable options via APC register and various SPI commands
Two individual input channels
  o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control) 
  o AnaIn: single-ended auxiliary analog input for recording or feed-through
Dual output channels
  o Differential PWM Class D speaker outputs directly drives an 8 Ωspeaker or a typical buzzer
  o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier
ChipCorder standard features
  o High-quality, natural voice and audio reproduction
  o 2.4V to 5.5V operating voltage
  o 100-year message retention (typical)
  o 100,000 record cycles (typical)
Temperature options:
  o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)
  o Industrial: -40°C to +85°C (packaged units)
Packaging types: available in die, PDIP, SOIC and TSOP
Package option: Lead-free packaged units