ISD1700 데이터 시트보기 (PDF) - Winbond

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ISD1700

Multi-Message Single-Chip Voice Record & Playback Devices

Winbond 

ISD1700 SERIES

TABLE OF CONTENTS

1 GENERAL DESCRIPTION ..............................................................................................................3

2 FEATURES......................................................................................................................................4

3 BLOCK DIAGRAM...........................................................................................................................5

4 PINOUT CONFIGURATION............................................................................................................6

5 PIN DESCRIPTION .........................................................................................................................7

6 MODES OF OPERATIONS .............................................................................................................8

6.1 Standalone (Push-Button) Mode .............................................................................................8

6.2 SPI Mode .................................................................................................................................8

7 TIMING DIAGRAMS ........................................................................................................................8

7.1 Standalone Operation ..............................................................................................................8

7.2 SPI Operation.........................................................................................................................12

8 ABSOLUTE MAXIMUM RATINGS ................................................................................................13

8.1 Operating Conditions .............................................................................................................13

9 ELECTRICAL CHARACTERISTICS .............................................................................................14

9.1 DC Parameters ......................................................................................................................14

9.2 AC Parameters.......................................................................................................................15

10 TYPICAL APPLICATION CIRCUITS.............................................................................................16

10.1 Good Audio Design Practices ................................................................................................18

11 PACKAGING .................................................................................................................................19

11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19

11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC) ..........................................20

11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21

11.4 Die Information.......................................................................................................................21

12 ORDERING INFORMATION .........................................................................................................22

13 VERSION HISTORY......................................................................................................................23

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