Description
True chip-scale packaging is available from International Rectifier. Through the use of advanced processing tech niques, and a unique packaging concept, extremely low on-resistance and the highest power densities in the industry have been made available for battery and load management applications. These benefits, combined with the ruggedized device design , that International Rectifier is well known for, provides the designer with an extremely efficient  and reliable device.

Ultra Low RDS(on) per Footprint Area
Low Thermal Resistance
P-Channel MOSFET
One-third Footprint of SOT-23
Super Low Profile (<.8mm)
Available Tested on Tape & Reel