Features
• Silicon chip on Direct-Copper-Bond substrate
    - High power dissipation
    - Isolated mounting surface
    - 2500V electrical isolation
• Low cathode to tab capacitance(<15pF)
• International standard package
• Very low VF
• Extremely low switching losses
• Low IRM-values
• Epoxy meets UL 94V-0

APPLICATIONs
• Rectifiers in switch mode power supplies (SMPS)
• Free wheeling diode in low voltage converters