DSI30-12AC 데이터시트 - IXYS CORPORATION
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DSI30-12AC
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78.4 kB
제조사
IXYS CORPORATION
Features
• Silicon chip on Direct-Copper-Bond substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
• Low cathode to tab capacitance(15pF typical)
• International standard package
• Epoxy meets UL 94V-0
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