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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크
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DIM100PHM33-F000 데이터시트 - Dynex Semiconductor

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DIM100PHM33-F000

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Dynex
Dynex Semiconductor Dynex

The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 2400A.
The DIM100PHM33-F000 is a half bridge 3300V soft punch through, n-channel enhancement mode, insulated gate bipolar transistor (IGBT) chopper module configured with the lower arm of the bridge controlled.. The IGBT has a wide reverse bias safe operating area (RBSOA). This device is optimised for traction drives and other applications requiring high thermal cycling capability.
The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.


FEATURES
• 10µs Short Circuit Withstand
• High Thermal Cycling Capability
• Soft Punch Through Silicon
• Isolated AlSiC Base with AlN Substrates
• Lead Free Construction


APPLICATIONS
• High Reliability Inverters
• Motor Controllers
• Traction Auxiliaries

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