CPD76X 데이터시트 - Central Semiconductor
부품명
CPD76X
Other PDF
no available.
PDF
page
2 Pages
File Size
400.8 kB
제조사
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL PLANAR
Die Size 32 x 32 MILS
Die Thickness 5.9 MILS
Anode Bonding Pad Area 27 x 27 MILS
Top Side Metalization Al - 20,000Å
Back Side Metalization Au - 12,000Å
부품명
상세내역
PDF
제조사
Share Link: