STTH2003CGY-TR 데이터 시트보기 (PDF) - STMicroelectronics
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STTH2003CGY-TR Datasheet PDF : 7 Pages
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STTH2003C-Y
2
Package information
Package information
● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6. D2PAK dimensions
Dimensions
Ref.
Millimeters
Inches
L2
L
L3
A
E
C2
D
A1
B2
B
G
C
R
A2
M*
V2
* FLAT ZONE NO LESS THAN 2mm
Min.
Max.
Min.
Max.
A
4.40
4.60 0.173 0.181
A1 2.49
2.69 0.098 0.106
A2 0.03
0.23 0.001 0.009
B
0.70
0.93 0.027 0.037
B2 1.14
1.70 0.045 0.067
C
0.45
0.60 0.017 0.024
C2 1.23
1.36 0.048 0.054
D
8.95
9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88
5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27
1.40 0.050 0.055
L3 1.40
1.75 0.055 0.069
M 2.40
3.20 0.094 0.126
R
0.40 typ.
0.016 typ.
V2
0°
8°
0°
8°
Figure 11. Footprint (dimensions in mm)
16.90
10.30
8.90
5.08
1.30
3.70
Doc ID 022396 Rev 1
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