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STTH3R06-Y
Characteristics
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead
(typical values)
Rth(j-a)(°C/W)
200
epoxy printed circuit board FR4, copper thickness: 35 µm
SMBflat
150
100
50
Scu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
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