NCP15XH103J03RC 데이터 시트보기 (PDF) - Murata Manufacturing
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NCP15XH103J03RC
Murata Manufacturing
NCP15XH103J03RC Datasheet PDF : 44 Pages
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!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Temperature Sensor and Compensation Chip Type !Caution/Notice
Continued from the preceding page.
2ECOMMENDED 4EMPERATURE 0ROFILE FOR 3OLDERING
A )NSUFFICIENT PREHEATING MAY CAUSE A CRACK ON CERAMIC
BODY 4HE DIFFERENCE BETWEEN PREHEATING TEMPERATURE
AND MAXIMUM TEMPERATURE IN THE PROFILE SHALL BE #
(b) Rapid cooling by dipping in solvent or by other means is
not recommended.
NCP03/15 Series
Reflow Soldering Conditions
0REHEATING IN AIR
Soldering
Gradual Cooling
(in air)
)N CASE OF REPEATED SOLDERING THE ACCUMULATED SOLDERING
TIME SHOULD BE WITHIN THE RANGE SHOWN IN THE FIGURE ABOVE
MIN SEC
0REHEATING ± # MIN
3OLDERING # SEC
NCP18/21 Series
Flow Soldering Conditions
0REHEATING IN AIR
Soldering
Gradual Cooling
(in air)
MIN SEC
0REHEATING ± # MIN
3OLDERING # SEC
Reflow Soldering Conditions
0REHEATING IN AIR
Soldering
Gradual Cooling
(in air)
MIN SEC
0REHEATING ± # MIN
3OLDERING # SEC
R44E.pdf
Dec.17,2012
3OLDER AND &LUX
3OLDER AND 0ASTE
A 2EFLOW 3OLDERING .#0 3ERIES
5SE 2!2-! TYPE OR EQUIVALENT TYPE OF SOLDER PASTE &OR
your reference, we are using the solder paste below for
any internal tests of this product.
s2-! - 3N0B WTWT
-ANUFACTURED BY !LPHA -ETALS *APAN ,TD
s-"- 3N!G#U WTWTWT
-ANUFACTURED BY 3ENJU -ETAL )NDUSTRY #O ,TD
B &LOW 3OLDERING .#0 3ERIES
We are using the solder paste below for any internal tests
of this product.
s3N0B WTWT
s3N!G#U WTWTWT
&LUX
Use rosin type flux in soldering process.
)F THE FLUX LISTED BELOW IS USED SOME PROBLEMS MIGHT BE
caused in the product characteristics and reliability.
0LEASE DO NOT USE THE FOLLOWING FLUX
s 3TRONG ACIDIC FLUX WITH HALIDE CONTENT EXCEEDING
WT
s 7ATERSOLUBLE FLUX
(*Water-soluble flux can be defined as non rosin type
flux including wash-type flux and non-wash-type flux.)
#LEANING #ONDITIONS
For removing the flux after soldering, observe the following
points in order to avoid deterioration of the characteristics or
any change of the external electrodes' quality.
s 0LEASE KEEP MOUNTED PARTS AND A SUBSTRATE FROM AN
occurrence of resonance in ultrasonic cleaning.
s 0LEASE DO NOT CLEAN THE PRODUCTS IN THE CASE OF USING A
non-washed type flux.
$RYING
After cleaning, promptly dry this product.
20
Solvent
NCP03/15
)SOPROPYL !LCOHOL
NCP18/21
)SOPROPYL !LCOHOL
Dipping Cleaning
,ESS THAN MINUTES AT
room temp. or less than
MINUTES AT # MAX
,ESS THAN MINUTES AT
room temp. or less than
MINUTES AT # MAX
Ultrasonic Cleaning
,ESS THAN MINUTES AND
7r
&REQUENCY OF K(Z TO
K(Z
,ESS THAN MINUTE AND
7r
Frequency of several
K(Z TO K(Z
Continued on the following page.
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