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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

NCV8184(2019) 데이터 시트보기 (PDF) - ON Semiconductor

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NCV8184 Datasheet PDF : 20 Pages
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Parameter
SOIC8 Package
JunctiontoPin 6 (YJL6, YJL6)
JunctiontoAmbient (RqJA, qJA)
Package construction
Without mold compound
NCV8184
PACKAGE THERMAL DATA
Conditions
Typical Value
100 mm2 Spreader Board
645 mm2 Spreader Board
1 oz
2 oz
1 oz
2 oz
53
51
50
47
151
135
111
100
Units
°C/W
°C/W
Figure 24. PCB Layout and Package Construction for Simulation
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