Parameter
SOIC−8 EP Package
Junction−to−Board (Y−JB, YJB)
Junction−to−Pin 6 (tab) (Y−JL6, YJL6)
Junction−to−Ambient (RqJA, qJA)
Package construction
Without mold compound
NCV8184
PACKAGE THERMAL DATA
Conditions
Typical Value
100 mm2 Spreader Board
645 mm2 Spreader Board
1 oz
2 oz
1 oz
2 oz
26
26
26
25
48
45
37
34
140
123
88
78
Units
°C/W
°C/W
°C/W
Figure 28. PCB Layout and Package Construction for Simulation
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