LLL317R71H103MD01K 데이터 시트보기 (PDF) - Unspecified
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LLL317R71H103MD01K Datasheet PDF : 296 Pages
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!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Nov.27,2017
Notice
Continued from the preceding page.
Table 2 Reflow Soldering Method
Series
Chip Dimension Code
(L/W)
GJM/GRM
02
GJM/GRM
03
GJM/GRM
15
GQM/GR3/GRJ/GRM 18
GQM
21
GR3/GRJ/GRM/GR7 21
GQM
22
GR3/GRJ/GRM/GR7 31
GR3/GRJ/GRM
32
GA2/GA3/GR4
42
GR3/GRJ/GRM/GA2/
GA3/GR4
43
GA2/GA3
52
GR3/GRJ/GRM/GA2/
GA3/GR4
55
LLL
15
LLL
1U
LLL/LLR
18
LLL
21
LLL
31
<Applicable to Part Number KR3/KRM>
Series
Chip Dimension Code
(L/W)
KRM
21
KRM
31
KR3/KRM
55
Chip (LgW)
0.4g0.2
0.6g0.3 (±0.03)
0.6g0.3 (±0.05)
0.6g0.3 (±0.09)
1.0g0.5 (within ±0.10)
1.0g0.5 (±0.15/±0.20)
1.6g0.8 (within ±0.10)
1.6g0.8 (±0.15/±0.20)
2.0g1.25
2.0×g1.25 (within ±0.10)
2.0g1.25 (±0.15)
2.0g1.25 (±0.20)
2.8g2.8
3.2g1.6 (within ±0.20)
3.2g1.6 (±0.30)
3.2g2.5
4.5g2.0
4.5g3.2
5.7g2.8
5.7g5.0
0.5g1.0
0.6g1.0
0.8g1.6
1.25g2.0
1.6g3.2
Chip (LgW)
2.0g1.25
3.2g1.6
5.7g5.0
a
0.16 to 0.2
0.2 to 0.25
0.2 to 0.25
0.23 to 0.3
0.3 to 0.5
0.4 to 0.6
0.6 to 0.8
0.7 to 0.9
1.0 to 1.2
1.2
1.2
1.0 to 1.4
2.2 to 2.5
1.8 to 2.0
1.9 to 2.1
2.0 to 2.4
2.8 to 3.4
3.0 to 3.5
4.0 to 4.6
4.0 to 4.6
0.15 to 0.2
0.20 to 0.25
0.2 to 0.3
0.4 to 0.5
0.6 to 0.8
a
1.0 to 1.2
2.2 to 2.4
2.6
b
0.12 to 0.18
0.2 to 0.3
0.25 to 0.35
0.25 to 0.35
0.35 to 0.45
0.4 to 0.5
0.6 to 0.7
0.7 to 0.8
0.6 to 0.7
0.6
0.6 to 0.8
0.6 to 0.8
0.8 to 1.0
0.9 to 1.2
1.0 to 1.3
1.0 to 1.2
1.2 to 1.4
1.2 to 1.4
1.4 to 1.6
1.4 to 1.6
0.2 to 0.25
0.25 to 0.35
0.3 to 0.4
0.4 to 0.5
0.6 to 0.7
b
0.6 to 0.7
0.8 to 0.9
2.7
c
0.2 to 0.23
0.25 to 0.35
0.3 to 0.4
0.3 to 0.4
0.4 to 0.6
0.5 to 0.7
0.6 to 0.8
0.8 to 1.0
0.8 to 1.1
1.25
1.2 to 1.4
1.2 to 1.4
1.9 to 2.3
1.5 to 1.7
1.7 to 1.9
1.8 to 2.3
1.4 to 1.8
2.3 to 3.0
2.1 to 2.6
3.5 to 4.8
0.7 to 1.0
0.7 to 1.0
1.4 to 1.6
1.4 to 1.8
2.6 to 2.8
(in mm)
c
0.8 to 1.1
1.0 to 1.4
5.6
(in mm)
Table 3 ZRB Series Reflow Soldering Method
Series
Chip Dimension
Code (L/W)
Chip (LgW)
a
b
c
ZRB 15
1.0g0.5 0.4 to 0.6 0.4 to 0.5 0.5 to 0.7
ZRB 18*
1.6g0.8 0.7 to 0.9 0.7 to 0.8 0.8 to 1.0
*If distance between parts is too short, there is risk to cause
electrical short. Please confirm the mounting pitch
(distance between centers of parts) has 1.275mm or more.
(ZRB18 only)
(in mm)
[Land for ZRB Series]
b
Table 4 LLA Series Reflow Soldering Method
Series
Chip Dimension Code
(L/W)
Chip (LgW)
LLA
18
LLA
21
1.6g0.8
2.0g1.25
a
0.3 to 0.4
0.5 to 0.7
b
0.25 to 0.35
0.35 to 0.6
ZRB
Land
a
Solder Resist
c
p
0.15 to 0.25
0.4
0.2 to 0.3
0.5
(in mm)
Continued on the following page.
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