LLL216R71H103MD01K 데이터 시트보기 (PDF) - Unspecified

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LLL216R71H103MD01K

Chip Multilayer Ceramic Capacitors for General

Unspecified 

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

Continued from the preceding page.

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in a

excessive solder fillet height.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause the

chips to crack.

4-2. Too little solder paste results in a lack of adhesive

strength on the termination, which may result in

chips breaking loose from the PCB.

4-3. Please confirm that solder has been applied

smoothly to the termination.

<Applicable to NFM Series>

[Guideline of solder paste thickness]

100-150µm: NFM15/18/21/3D/31

100-200µm: NFM41

NFM15CC/15PC

NFM18CC/18PC

0.4

0.25

1.0

0.7

2.2

1.3

C02E.pdf

Nov.27,2017

NFM18PS

NFM21CC/21PC

0.8

0.05 1.2

2.0

NFM21PS

0.6

1.4

2.6

NFM3DCC/3DPC

0.8

1.2

1.6

1.8

2.6

NFM31PC/31KC

1.0

2.5

3.9

NFM41CC/41PC

1.5

1.0

3.5

2.5

5.5

4.4

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to

the PCB.

Continued on the following page.

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