LLL216R71H103MD01K 데이터 시트보기 (PDF) - Unspecified

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LLL216R71H103MD01K

Chip Multilayer Ceramic Capacitors for General

Unspecified 

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

C02E.pdf

Nov.27,2017

!Caution

Continued from the preceding page.

4-1. Reflow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB.

Preheating conditions are shown in table 1. It is required to

keep the temperature di erential between the solder and

the components surface (∆T) as small as possible.

2. When components are immersed in solvent a er mounting,

be sure to maintain the temperature di erence (∆T)

between the component and the solvent within the range

shown in table 1.

Table 1

Series

Chip Dimension Code Temperature

(L/W)

Di erential

GRM/GJM/GQM/GR3/

GRJ/KRM/LLR/NFM/GR7

02/03/15/18/21/31

LLL

02/03/15/18/1U/21/31

ZRB

15/18

GR3/GRJ/GRM/KR3/KRM

GA2/GA3/GR4

32/42/43/52/55

LLA/LLM

GQM

18/21/31

22

∆T<=190°C

∆T<=130°C

Recommended Conditions

Peak Temperature

Atmosphere

Pb-Sn Solder

230 to 250°C

Air

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Lead Free Solder

240 to 260°C

Air or N2

[Example of Temperature Conditions for Reflow Soldering]

Temperature (°C)

Peak Temperature

220°C (200°C)

∆T

190°C (170°C)

170°C (150°C)

150°C (130°C)

Soldering

Gradual

Cooling

Preheating

Time

60-120 seconds 30-60 seconds

Temperature

Incase of Lead Free Solder

( ): In case of Pb-Sn Solder

[Allowable Reflow Soldering Temperature and Time]

280

270

260

250

240

230

220

0

30

60

90

120

Soldering Time (s)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

3. When a capacitor is mounted at a temperature lower

than the peak reflow temperature recommended by the

solder manufacturer, the following quality problems can

occur. Consider factors such as the placement of

peripheral components and the reflow temperature

setting to prevent the capacitor’s reflow temperature

from dropping below the peak temperature specified. Be

sure to evaluate the mounting situation beforehand and

verify that none of the following problems occur.

• Drop in solder wettability

• Solder voids

• Possible occurrence of whiskering

• Drop in bonding strength

• Drop in self-alignment properties

• Possible occurrence of tombstones and/or shifting on

the land patterns of the circuit board

Continued on the following page.

273

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