MM908E625 데이터 시트보기 (PDF) - Freescale Semiconductor

부품명

상세내역

일치하는 목록

MM908E625

Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Supply Voltage

Analog Chip Supply Voltage under Normal Operation, Steady State

Analog Chip Supply Voltage under Transient Conditions (1)

Microcontroller Chip Supply Voltage

Input Pin Voltage

Analog Chip

Microcontroller Chip

Maximum Microcontroller Current per Pin

All Pins Except VDD, VSS, PTA0:PTA6, PTC0:PTC1

Pins PTA0:PTA6, PTC0:PTC1

Maximum Microcontroller VSS Output Current

Maximum Microcontroller VDD Input Current

LIN Supply Voltage

Normal Operation (Steady-State)

Transient Conditions (1)

ESD Voltage

Human Body Model (HBM)(2)

Machine Model (MM)(3)

Charge Device Model (CDM)(4)

V

VSUP(SS)

-0.3 to 28

VSUP(PK)

-0.3 to 40

VDD

-0.3 to 6.0

V

VIN (ANALOG)

VIN (MCU)

-0.3 to 5.5

VSS-0.3 to VDD+0.3

mA

IPIN(1)

±15

IPIN(2)

± 25

IMVSS

100

mA

IMVDD

100

mA

V

VBUS(SS)

VBUS(DYNAMIC)

-18 to 28

40

V

VESD

± 3000

± 150

± 500

THERMAL RATINGS

Storage Temperature

Ambient Operating Temperature

Operating Case Temperature (5)

TSTG

-40 to 150

°C

TA

-40 to 85

°C

TC

-40 to 85

°C

Operating Junction Temperature(6)

Peak Package Reflow Temperature During Reflow(7)(8)

TJ

-40 to 125

°C

TPPRT

Note 8

°C

Notes

1. Transient capability for pulses with a time of t < 0.5 sec.

2. ESD voltage testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω)

3. ESD voltage testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 Ω)

4. ESD voltage testing is performed in accordance with Charge Device Model, robotic (CZAP =4.0 pF).

5. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.

6. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because

of higher power dissipation on the analog die. The analog die temperature must not exceed 150 °C under these conditions.

7. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause

malfunction or permanent damage to the device.

8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

Freescale Semiconductor

908E625

5

Share Link: