XC9119D10A 데이터 시트보기 (PDF) - TOREX SEMICONDUCTOR

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XC9119D10A

1MHz, PWM Controlled, Step-Up DC/DC Converter, Ceramic Capacitor Compatible

TOREX SEMICONDUCTOR 

XC9119D10A

Series

■OPERATIONAL EXPLANATION (Continued)

<Lx (Pin No. 1): Switch Pin>

Please connect the anode of an Schottky barrier diode and inductor to the Lx pin.

<FB (Pin No. 3): Voltage Feedback Pin>

The reference voltage is 1.0V (TYP.). Output voltage is approximated by the following equation according to the value

for two resistors (RFB1 and RFB2). The sum of the two resistors should be 1MΩ or less.

VOUT = RFB1 / RFB2 + 1

Output voltage should be set as to fill VOUT<(Maximum value of VLx) – (VF of Schottky diode).

Please adjust the CFB value of the speed–up capacitor for phase compensation so that fzfb=1/(2πx CFB x RFB1) will be

about 500Hz. According to the usage, adjusting the inductance value, the load capacity value, and so on to the most

suitable operation.

Typical example:

VOUT

(V)

RFB1

(kΩ)

3.3

300

5.0

300

7.0

180

10.0

270

15.0

510

18.0

510

RFB2

(kΩ)

130

75

30

30

36

30

CFB

(pF)

1000

1000

1800

1200

510

510

<VDD (Pin No. 5): Power Supply Pin>

Please connect an input by-pass capacitor (CIN).

●Application Information

<Obtaining VDD from other source than VIN>

In case that the input voltage VIN and power source VDD in the step-up circuit are isolated, the circuit starts step-up

operations with the input voltage less than 2.5V when voltage from 2.5V to 6.0V is applied to the power source. Please

connect more than 1uF of CDD between the VDD pin and the VSS pin as close as possible.

Ex.) When VDD=3.6V, VIN=1.8V, VOUT=5.0V (RFB1=300kΩ, RFB2=75kΩ, CFB=1000pF, CL=10uF), the IC can operate up to

IOUT=40mA.

VDD

2.5V~6V

CDD

L

SD

RSS

VDD

CIN

VIN

4.7uF

CE/SS

Lx

RFB1

CFB

FB

CL

10uF

CSS

VSS

RFB2

■NOTES ON USE

1. Please do not exceed the value of stated absolute maximum ratings.

2. The DC/DC converter performance is greatly influenced by not only the ICs’ characteristics, but also by those of the

external components. Care must be taken when selecting the external components.

3. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground

currents at the time of switching may result in instability of the IC.

4. Please mount each external component as close to the IC as possible and use thick, short connecting traces to reduce

the circuit impedance.

5. Please set up the output voltage value so that the Lx pin voltage does not exceed 20V.

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