U631H256XS 데이터 시트보기 (PDF) - Simtek Corporation

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U631H256XS

SoftStore 32K x 8 nvSRAM Die

Simtek Corporation 

Test Configuration for Functional Check

A0

A1

VCCw

A2

A3

A4

DQ0

A5

DQ1

VIH

A6

A7

DQ2

A8

DQ3

A9

DQ4

A10

DQ5

VIL

A11

A12

DQ6

A13

DQ7

A14

E

W

G

VSS

U631H256XS

5V

480

VO

30 pF v

255

v: In measurement of tdis-times and ten-times the capacitance is 5 pF.

w: Between VCC and VSS must be connected a high frequency bypass capacitor 0.1 μF to avoid disturbances.

Capacitancee

Conditions

Symbol

Input Capacitance

Output Capacitance

VCC = 5.0 V

CI

VI

= VSS

f

= 1 MHz

Ta

= 25 °C

CO

All pins not under test must be connected with ground by capacitors.

Min.

Max.

8

7

Unit

pF

pF

Bonding Instructions

The U631H256XS has 29 relevant bond pads and 6 additional pads.

The 6 additional pads must not be bonded.

Refer to the bond pad location and identification table for a complete list of pads and coordinates.

Always both VCC pads have to be connected.

It is mandatory to use two bond wires on VCC and VSS doublebond pads for noise immunity.

The backside of the die is connected to VCC and can be contacted with the substrate in case of the same potential.

March 31, 2006

STK Control #ML0044

9

Rev 1.0

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