U631H256XS 데이터 시트보기 (PDF) - Simtek Corporation
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U631H256XS Datasheet PDF : 15 Pages
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U631H256XS
Bond pad location and identification table (origin: down left corner)
Pad
A2
A1
A0
DQ0
DQ1
DQ2
VSS
VSS
VCC
DQ3
DQ4
DQ5
DQ6
DQ7
E
A10
VSE
G
A11
x / μm
135
135
405
960
1170
1445
1653,2
1810,8
2000
2215
2490
2700
2975
3185
3460
3460
3510
3510
3510
y / μm
365
175
140
140
140
140
140
140
140
140
140
140
140
140
175
365
8885
9050
9240
Pad
VSEF
A9
A8
A13
W
HSB
VCCX
VBND
VCC
VCC
VBG
A14
A12
A7
A6
A5
A4
A3
x / μm
3505
3275
3085
2875
2685
2405
2165
1740
1576,8
1419,2
1295
1120
910
720
510
320
85
85
y / μm
9410
9400
9400
9400
9400
9400
9400
9400
9400
9400
9400
9400
9400
9400
9400
9400
9357,5
9125
The pads VSE, VSEF, HSB, VCCX, VBND, VBG must not be bonded.
Applying any signal or voltage to these pads could damage the chip or influence the functionality.
STK Control #ML0044 10
Rev 1.0
March 31, 2006
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