U631H256XS 데이터 시트보기 (PDF) - Simtek Corporation

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U631H256XS

SoftStore 32K x 8 nvSRAM Die

Simtek Corporation 

A5 A6 A7 A12 A14 VCC

A4

A3

W A13 A8 A9

A11

G

U631H256XS

Waferdiameter : 125 mm

Waferthickness : (390 ±10) μm

Die size :

(3,73 x 9,62) mm2

(stepping interval)

Bond pad size : (110 x 110) μm2

Passivation

openings :

(100 x 100) μm2

Polyimid-

passivation :

(4 ± 0.5) μm

A2

A10

A1

E

A0 DQ0 DQ1 DQ2 VSS VCC DQ3 DQ4 DQ5 DQ6 DQ7

March 31, 2006

STK Control #ML0044

11

Rev 1.0

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