Package mechanical data
STTH512
Table 7. DPAK dimensions
DIMENSIONS
REF. Millimeters
Inches
H
L4
E
B2
L2
A
C2
B
G
D
R
A1
R
C
A2
0.60 MIN.
V2
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2
0.80 typ.
0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0°
8°
0°
8°
Figure 14. DPAK footprint (dimensions in mm)
6.7
3
3
1.6
2.3
6.7
2.3
1.6
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
8/10