STTH312
Characteristics
Figure 11. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
10
VR(V)
1
1
10
100
1000
Figure 12.
Thermal resistance junction to
ambient versus copper surface
under tab (printed circuit board
FR4, ecu = 35 µm)
Rth(j-a)(°C/W)
100
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0
5
10
15
20
25
30
35
40
5/8