ST7585 데이터 시트보기 (PDF) - Sitronix Technology Co., Ltd.

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ST7585

66 x 102 Dot Matrix LCD Controller/Driver

Sitronix Technology Co., Ltd. 

ST7585

3. ST7585 PAD ARRANGEMENT

Chip Size: 4720 X 650

Unit: um

Chip Thickness: 300

Bump Height: 15

PAD No.

Bump Size

5~11

35 X 57

1~4, 12~78

45 X 57

79~248

15 X 137.5

PAD No.

Bump Pitch (min)

5~11

50

1~4, 12~78

60

79~248

27

* Refer “PAD CENTER COORDINATES” section for ITO layout.

Ver 1.0c

Fig 1.

2/51

2009/04/14

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