NCP334 데이터 시트보기 (PDF) - ON Semiconductor

부품명

상세내역

일치하는 목록

NCP334

2A Ultra-Small Controlled Load Switch with Auto-Discharge Path

ON Semiconductor 

NCP334, NCP335

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

IN, OUT, EN, Pins

From IN to OUT Pins: Input/Output

Maximum Junction Temperature

Storage Temperature Range

Human Body Model (HBM) ESD Rating are (Notes 1 and 2)

VEN , VIN,

0.3 to + 7.0

V

VOUT

VIN,

0 to + 7.0

V

VOUT

TJ

−40 to + 125

°C

TSTG

−40 to + 150

°C

ESD HBM

4000

V

Machine Model (MM) ESD Rating are (Notes 1 and 2)

ESD MM

250

V

Charge Device Model (CDM) ESD Rating are (Notes 1 and 2)

ESD CDM

2000

V

Latch−up protection (Note 3)

− Pins IN, OUT, EN

LU

mA

100

Moisture Sensitivity (Note 4)

MSL

Level 1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. According to JEDEC standard JESD22−A108.

2. This device series contains ESD protection and passes the following tests:

Human Body Model (HBM) ±4.0 kV per JEDEC standard: JESD22−A114 for all pins.

Machine Model (MM) ±250 V per JEDEC standard: JESD22−A115 for all pins.

Charge Device Model (CDM) ±2.0 kV per JEDEC standard: JESD22−C101 for all pins.

3. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.

4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.

OPERATING CONDITIONS

Symbol

Parameter

Conditions

Min

Typ

Max Unit

VIN

VEN

TA

CIN

COUT

RqJA

IOUT

PD

Operational Power Supply

Enable Voltage

Ambient Temperature Range

Decoupling input capacitor

Decoupling output capacitor

Thermal Resistance Junction to Air

Maximum DC current

Power Dissipation Rating (Note 6)

1.2

5.5

V

0

5.5

−40

25

+ 85

°C

1

mF

1

mF

WLCSP package (Note 5)

100

°C/W

2

A

TA ≤ 25

°C

WLCSP

package

0.5

W

TA =

WLCSP

0.2

W

85°C

package

5. The RqJA is dependent of the PCB heat dissipation and thermal via.

6. The maximum power dissipation (PD) is given by the following formula:

PD

+

TJMAX *

RqJA

TA

http://onsemi.com

3

Share Link: