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MCP40D17-103AE 데이터 시트보기 (PDF) - Microchip Technology

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MCP40D17-103AE Datasheet PDF : 66 Pages
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1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Voltage on VDD with respect to VSS ..... -0.6V to +7.0V
Voltage on SCL, and SDA with respect to VSS
............................................................................. -0.6V to 12.5V
Voltage on all other pins (A, W, and B)
with respect to VSS ............................ -0.3V to VDD + 0.3V
Input clamp current, IIK
(VI < 0, VI > VDD, VI > VPP ON HV pins) ........... ±20 mA
Output clamp current, IOK
(VO < 0 or VO > VDD) ....................................... ±20 mA
Maximum output current sunk by any Output pin
........................................................................... 25 mA
Maximum output current sourced by any Output pin
........................................................................... 25 mA
Maximum current out of VSS pin ...................... 100 mA
Maximum current into VDD pin ......................... 100 mA
Maximum current into A, W and B pins........... ±2.5 mA
Package power dissipation (TA = +50°C, TJ = +150°C)
SC70-5 ............................................................ 302 mW
SC70-6 ............................................................ 483 mW
Storage temperature .......................... -65°C to +150°C
Ambient temperature with power applied
........................................................... -40°C to +125°C
ESD protection on all pins ........................≥ 4 kV (HBM)
........................................................................≥ 400V (MM)
Maximum Junction Temperature (TJ) .............. +150°C
MCP40D17/18/19
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
© 2009 Microchip Technology Inc.
DS22152B-page 3

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