LT3030HFE-PBF 데이터 시트보기 (PDF) - Linear Technology

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LT3030HFE-PBF

Dual 750mA/250mA Low Dropout, Low Noise, Micropower Linear Regulator

Linear Technology 

LT3030

Package Description

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

FE Package

20-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663 Rev J)

FE Package

20-Lead PlasEtixcpToSseSdOPPa(d4.V4amriamti)on CB

(Reference LTC DWG # 05-08-1663 Rev J)

Exposed Pad Variation CB

3.86

(.152)

6.40 – 6.60*

(.252 – .260)

3.86

(.152)

20 1918 17 16 15 14 1312 11

6.60 ±0.10

4.50 ±0.10

SEE NOTE 4

2.74

(.108)

0.45 ±0.05

1.05 ±0.10

0.65 BSC

RECOMMENDED SOLDER PAD LAYOUT

4.30 – 4.50*

(.169 – .177)

0.25

REF

0° – 8°

2.74

(.108)

6.40

(.252)

BSC

1 2 3 4 5 6 7 8 9 10

1.20

(.047)

MAX

0.09 – 0.20

(.0035 – .0079)

0.50 – 0.75

(.020 – .030)

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2.

DIMENSIONS

ARE

IN

MILLIMETERS

(INCHES)

3. DRAWING NOT TO SCALE

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

0.05 – 0.15

(.002 – .006)

FE20 (CB) TSSOP REV J 1012

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

3030fa

20

For more information www.linear.com/LT3030

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