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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

7411(2017) 데이터 시트보기 (PDF) - Analog Devices

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7411 Datasheet PDF : 36 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
VDD to GND
Analog Input Voltage to GND
Digital Input Voltage to GND
Operating Temperature Range
Storage Temperature Range
Junction Temperature
16-Lead QSOP
Power Dissipation1
Thermal Impedance2
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +120°C
−65°C to +150°C
150°C
(TJmax − TA)/θJA
θJA Junction-to-Ambient
θJC Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
105.44°C/W
38.8°C/W
220°C (0°C/5°C)
10 sec to 20 sec
2°C/sec to 3°C/sec
−6°C/sec
IR Reflow Soldering (Pb-Free Package)
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
260°C (+0°C)
20 sec to 40 sec
3°C/sec maximum
−6°C/sec maximum
8 minutes maximum
1 Values relate to package being used on a 4-layer board.
2 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled PCB-
mounted components.
ADT7411
Table 3. I2C Address Selection
ADD Pin
I2C Address
Low
1001 000
Float
1001 010
High
1001 011
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Rev. C | Page 7 of 36

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