4-5435166-9(RevB) 데이터 시트보기 (PDF) - Tyco Electronics
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4-5435166-9 Datasheet PDF : 7 Pages
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DIP Programming Switches (7000 and 7100 Series)
114-1056
NOTE
If you have a particular solvent that is not listed, contact PRODUCT INFORMATION at the number at the bottom of
page 1.
D. Drying
When drying cleaned unsealed assemblies and pc boards, make certain that the housing temperature
does not exceed 130_C [270_F]. Excessive temperatures may cause housing degradation. When
processing the economy sealant, make certain that the sealant temperature does not exceed 100_C
[212_F] for 1 minute. This is a hot melt sealant and will reflow.
3.8. Checking Installed Switches
The solder tail must be through its intended hole in the pc board. Solder fillet must be evenly formed around
each solder tail. The housing of the switch must be seated on the pc board not exceeding the dimension given
in Figure 4.
3.9. Removal and Repair
Damaged or defective switches must NOT be used and should be replaced. The switches must be removed
from the pc board by standard de–soldering methods.
CAUTION
When removing or replacing switches, care must be taken not to damage other pc board components during the
de-soldering process.
4. QUALIFICATIONS
DIP Programming Switches are not required to be agency approved.
5. TOOLING
No tooling is required for manual placement of these switches; however, a pc board support that provides relief
for protruding components must be used to prevent deformation of contact tails. The pc board support must be
custom made. See Figure 7.
PC Board Support
(Customer Supplied)
Holes
(Ref)
Channel
(Ref)
Figure 7
6 of 7
Rev B
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