SL1ICS3101 데이터 시트보기 (PDF) - Philips Electronics

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SL1ICS3101

I-CODE1 Label IC (97 pF)

Philips Electronics 

Philips Semiconductors

I-CODE1 Label IC (97 pF)

Product specification

SL1ICS3101

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); notes 1 and 2.

SYMBOL

Tstg

Tj

Vesd

Ii(LA-LB)(p)

PARAMETER

storage temperature

junction temperature

electrostatic discharge voltage

input current (peak value)

CONDITIONS

note 3

note 4

MIN.

−55

−55

−2

−80

TYP.

−

−

−

−

MAX.

+140

+140

+2

+80

UNIT

°C

°C

kV

mA

Notes

1. Stresses above those listed in this table may cause permanent damage to the device. This is a stress rating only and

functional operation of the device at these or any conditions other than those described in Chapter 11 is not implied.

2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects

of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying

greater than the rated maxima.

3. Human Body Model (HBM) in accordance with “MIL-STD-883D Method 3015.7”.

4. At 13.56 MHz including current via resonant capacitor.

9 QUALITY ASSURANCE

9.1 Electrical acceptance test

The electrical acceptance test is performed in line

(‘sampling on the fly’) according to the test specifications.

Sampling plan:

• According to document “General quality specification”.

9.2 Visual inspection

9.2.1 AFTER WAFER FINAL TEST

Performed according to document “SNW-FQ-627”.

Sampling plan:

• According to document “General quality specification”.

10 HANDLING INSTRUCTIONS

Please refer to Philips “General specification for 6” wafer”

for the following items:

• Sawing

• Die attach

• Wire bonding.

9.2.2 AFTER SAWING (FILM FRAME CARRIER)

Performed according to document “PICTOH-QS007”.

Sampling plan (3 wafers per lot):

• Accept 0 to 3.

2002 May 23

8

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