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SL1ICS3101

I-CODE1 Label IC (97 pF)

Philips Electronics 

Philips Semiconductors

I-CODE1 Label IC (97 pF)

Product specification

SL1ICS3101

6. Definition: m = V-V----mm----aa--xx----+–----V-V----mm----ii-nn-

7. Bandwidth limitation (±7 kHz) according to ISM band regulations.

8. The given values are derived from the 13.56 MHz system frequency.

9. Recommended values for pulse duration generated at the read/write device.

12 MECHANICAL CHARACTERISTICS

12.1 Die specifications

PARAMETER

Designation

Bond pad location

Bond pad size: LA and LB

Test pad size: TEST and VSS

Bond pad metallization material

Metallization thickness

Die dimensions (including 80 µm scribe line)

Die dimensions (excluding scribe line)

Tolerances for sawn dies

Pad identification

Top side passivation material

Passivation thickness

VALUE

VCOL1V0; visible on each die (see Fig.3)

see Fig.3

130 × 150 µm

90 × 90 µm

AlSiCu

1.4 µm

1460 × 1490 µm

1380 × 1410 µm

25 µm

see Fig.2

oxynitride; notes 1 and 2

1.6 µm

Notes

1. The passivation is a protection of active areas against dust (particles), humidity, and general contamination (whole

surface of the chip except for the bond pads).

2. Due to the glass-like physical properties careful handling and processing is required.

2002 May 23

10

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