Philips Semiconductors
I-CODE1 Label IC (97 pF)
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
8
9
9.1
9.2
9.2.1
9.2.2
10
11
12
12.1
12.2
13
13.1
13.2
13.3
13.4
13.5
13.6
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Memory organization
Serial number
Write access conditions
Special functions
Family code and application identifier
User data
LIMITING VALUES
QUALITY ASSURANCE
Electrical acceptance test
Visual inspection
After wafer final test
After sawing (film frame carrier)
HANDLING INSTRUCTIONS
ELECTRICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
Die specifications
Wafer specifications
APPLICATION INFORMATION
Protection against visible light
Protection against UV light
Resistance to X-rays
Characterisation of inlet and label
Final test of the inlet and label
Coil specification
Product specification
SL1ICS3101
14
14.1
14.2
14.3
14.3.1
14.3.2
14.3.3
15
16
17
18
DELIVERY
Configuration of delivered ICs
Packing
Documentation
Delivery documentation
Fail-die identification
Wafer mapping
REFERENCE DOCUMENTS
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2002 May 23
2