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MPVZ5004

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

Pressure

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE

MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

0.060 TYP 8X

1.52

0.660

16.76

0.100 TYP 8X

2.54

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 6. SOP Footprint (Case 482)

MPXV5004G

6

Sensors

Freescale Semiconductor

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