MMG3009NT1(2006) 데이터 시트보기 (PDF) - Freescale Semiconductor
부품명
상세내역
일치하는 목록
MMG3009NT1 Datasheet PDF : 12 Pages
| |||
1.7
3.48
5.33
1.27
0.58
0.86
0.64
3.86
Recommended Solder Stencil
7.62
0.305 diameter
2.49
1.27
2.54
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 20. Recommended Mounting Configuration
MMG3009NT1
6 - 10
Freescale Semiconductor
RF Product Device Data
Share Link: 