MMG3009NT1(2006) 데이터 시트보기 (PDF) - Freescale Semiconductor
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MMG3009NT1 Datasheet PDF : 12 Pages
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A
0.60
B
0.40
3 4 2.70
2.40
PACKAGE DIMENSIONS
34
4.70
4.40
1.87
1.79
0.15 M C A B
2X R0.15 TYP
4.50
3.70
1.70
1.40
2X 4° TYP
1.50
1.30
0.70
51
2
0.48
0.38
0.58
0.48
0.15 M C A B
3
2X
0.20 M C B
0.48
0.38
0.15 M C A B
0.46
0.40
2X 4 ° TYP
E.P.
2X R0.20
4X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.5MM PER END. DIMENSION DOES
NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED 0.5MM PER SIDE.
4. DIMENSIONS ARE DETERMINED AT THE OUTMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING
ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
0.10 C
1.35
1.25
SEATING PLANE
0.65
0.55
C
1.50
1.65
1.55
STYLE 1:
PIN 1. RF INPUT
2. GROUND
3. RF OUTPUT
Freescale Semiconductor
RF Product Device Data
CASE 1514 - 01
ISSUE C
SOT - 89
PLASTIC
BOTTOM VIEW
MMG3009NT1
6 - 11
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