Z4KE190 데이터시트 - Vishay Semiconductors
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Z4KE190
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Vishay Semiconductors
FEATURES
• Plastic MELF package
• Ideal for automated placement
• Glass passivated chip junction
• Low Zener impedance
• Low regulation factor
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For general purpose regulation and protection applications.
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