FEATURES
• Square RBSOA
• HEXFRED® low Qrr, low switching energy
• Positive VCE(on) temperature coefficient
• Copper baseplate
• Low stray inductance design
• Designed and qualified for industrial market
• UL approved file E78996
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

BenefitS
• Benchmark efficiency for SMPS appreciation in particular HF welding
• Rugged transient performance
• Low EMI, requires less snubbing
• Direct mounting to heatsink space saving
• PCB solderable terminals
• Low junction to case thermal resistance