Features
• Ultra compact LLP1006-2L package
• Low package height < 0.4 mm
• 1-line ESD-protection
• Low leakage current < 0.01 µA
• Low load capacitance CD = 12.5 pF
   (VR = 6 V; f = 1 MHz)
• ESD-protection acc. IEC 61000-4-2
   ± 30 kV contact discharge
   ± 30 kV air discharge
• High surge current acc. IEC61000-4-5 IPP > 4 A
• Soldering can be checked by standard vision
   inspection. No X-ray necessary
• Lead (Pb)-free component
• Pin plating NiPdAu (e4) no whisker growth
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC