Description
Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic.

FEATUREs
• ESD protection to IEC 61000-4-2 30 kV (air)
• ESD protection to IEC 61000-4-2 8 kV (contact)
• ESD protection to IEC 61000-4-5
   (lightning): 8/20 µs, IPPM = 10 mA
• 120 W peak pulse power dissipation per line
   (8/20 µs)
• Suitable for high frequency applications
   (low capacitance, low parasitic inductance)
• Low clamping voltage
• Minimum PCB space needed (0.5 mm2),
   < 0.55 mm height, only 0.47 mg/pcs
• No need for underfill material and/or additional
   solder
• Can be assembled using standard SMT pick &
   place equipment, reflow processes per J-STD-020
   and assembly methods
• Green product

APPLICATIONs
   Cellular phones
   Personal digital assistants (PDA), notebook computers
   MP3 players
   GPS
   Digital cameras
   Bluetooth
   Audio amplifiers
   DVD
   Power management systems
   Read write heads for hard drives
   Modules for watches
   CPU
   Digital TV’s and sattelites receivers
   SMART cards