US3MBF-PJ 데이터시트 - Dongguan Pingjingsemi Technology Co., Ltd,
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US3MBF-PJ
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452.7 kB
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Dongguan Pingjingsemi Technology Co., Ltd,
FEATURES
✦ For surface mount applications
✦ Glass passivated chip junction
✦ Low profile package
✦ Easy to pick and place
✦ Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
✦ Case: SMBF molded plastic body
✦ Terminals: Solderable per MIL-STD- 750, Method 2026
✦ Weight: Approximated 0.057 grams
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