UH1C 데이터시트 - Shenzhen Taychipst Electronic Co., Ltd
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UH1C
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Shenzhen Taychipst Electronic Co., Ltd
FEATURES
• Low profile package
• Ideal for automated placement
• Oxide planar chip junction
• Ultrafast recovery times for high frequency
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
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